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As one of the promising lead-free interconnection materials, electrically conductive adhesive (ECA) has made considerable advances in recent years. Compared to metal solder, ECAs offer numerous advantages, such as environmental friendliness (elimination of lead usage and flux cleaning), mild processing conditions, fewer processing steps (reducing processing cost), low stress on the substrates and...
This paper presents a crosstalk model base on even-odd mode analysis. It demonstrates that crosstalk analysis needs to look at the aspect of the timing delay between even and odd mode and the multiple reflections that occurred in a system. This concept is validated further by measurement result.
Anisotropic conductive adhesives (ACAs) have been considered a promising interconnect material for next generation high performance devices. However, high joint resistance and low current carrying capability of ACA interconnects have been the limitations to utilizing ACAs in high power devices. In this study, we have introduced conjugated dithiols into ACA formulations to create molecular wire junctions...
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