The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Drop test performance is one of the key reliability parameters for characterizing electronic packages such as ball grid array (BGA) under mechanical stresses. It is especially important for a large BGA in a handheld device such as a smart-phone or tablet where the solder joint tends to crack under mechanical stress. This has gained more and more interest as mobile computing becomes dominant for next...
To combat reliability margin loss in ball grid array (BGA) packages specifically in mechanical shock and vibration testing, companies are exploring the possibility of using glue and complete underfill to mitigate risk to second-level interconnects (SLI). Though glue has been demonstrated to have a positive influence on SLI reliability margin, it can have adverse affects on the rest of the package...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.