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Virtualization is the main underlying technology for cloud computing. The popularity of cloud computing had expanded rapidly over the past few years. As any new technology advancement, cloud computing also has vulnerability possibilities and potential security risks. Therefore it is important to study and understand the underlying technologies in cloud computing and test any possible loophole that...
This paper presents a fundamental method to evaluate thermal fatigue life of power module. Coupled electrical-thermal analysis was performed to obtain the distribution of temperature due to electric current. Then, thermo-mechanical analysis was carried out to calculate inelastic strain range generated in a solder joint. Crack path simulation technique was used to evaluate total fatigue life and rise...
This paper presents the effect of creep properties on pressure-induced tin whisker formation. Creep properties of bright SnPb and SnCu finishes were evaluated by using a nanoindentation test. At the early stage of indentation, power law creep has a small scatter in both plating finishes. On the other hands, diffusion creep in SnCu show big scatter than SnPb. This behavior can explain the whisker formation...
For power devices, the reliability of thermal fatigue induced by power cycling has been prioritized as an important concern. Because, the power device like the converter system is the key in vehicle applications. So, high reliability is demanded by reduction in the size and high power capacity. Therefore shortening reliability evaluation is demanded using finite element method (FEM). Since power cycling...
For power electronics devices, the reliability of thermal fatigue induced by power cycling has been prioritized as an important concern. Since power cycling produces non-uniform temperature distribution in the device, coupled thermal- structure analysis is required to evaluate thermal fatigue mechanism. The thermal expansion difference between a package and a substrate causes thermal fatigue. Many...
As the integration and the miniaturization of electronics devices, design space become narrower and interactions between design factors affect their reliability. This paper presents a methodology of quantifying the interaction of each design factor in electronics devices. Thermal fatigue reliability of BGA assembly was assessed with the consideration of the interaction between design factors. Sensitivity...
Recently, the electronic device equipments using a lot of semiconductors are widespread to all industrial fields. Solder joints are used to mount the electronic chips, such as ceramic resistors and capacitors, on the printed-circuit boards in almost all electronic devices. However, since in many cases the thermal expansion coefficients of electronic parts and PCBs have mismatch, cyclic thermal stress...
In electronic equipment, the estimated lifetime of a solder joint is being intensively investigated. For the assessment of thermal fatigue reliability, the mechanical properties of solder joints with regard to inelastic characteristics at a range of temperatures must be known. However, measuring solder's material properties is costly and time-consuming. Thus, a quick and simple technique should be...
Recently, there have been serious debates about whether Pb should be removed from solder joint, in view of environmental problems. These debates have now developed to the extent that a remarkable movement to establish regulations for the removal of Pb has emerged, especially in European countries and Japan. Therefore, many studies have been aggressively undertaken to develop technologies for replacing...
The purpose of this study was to analyze the drop reliability of solder joints in assembled IC package on print wiring board (PWB) from viewpoint of structure of test equipment. Considering reliability of mobile devices, it was important to establish the drop reliability for solder joints. In this paper, the repetitive drop test with simple equipment was carried out to evaluate the drop reliability...
The recent development of electric and electronic devices has been remarkable. The miniaturization of electronic devices and high integration are progressing by advances in mounting technology. As a result, the reliability of fatigue life has been prioritized as an important concern, since the thermal expansion difference between a package and printed circuit board causes thermal fatigue. In addition,...
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