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The development of an interconnection method based on electromagnetic coupling for hermetic or vacuum packaging in RF-MEMS applications is presented in this paper. Combined with wafer-level packaging by anodic bonding, it minimizes the leakage probability of such package by avoiding the use of vertical interconnections or horizontal feedthroughs. Electromagnetic simulations will be discussed and compared...
The early developments of an optical gas sensor combining plasma ignition by silicon electrode arrays and optical detection coupled with image processing are presented in this paper. The principle of the sensor under development is based on the ionization of chemical species under intense electrical fields and the detection by optical sensors of photons created by glow discharges. Electrodes optimization...
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