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We report a localized mechanical property study by using the nano-indentation continuous stiffness measurement (CSM) technology on Pb-free solder joints with and without electromigration. The tensile test structure of a solder ball connected by two Cu wires of 300mum diameters was prepared and tested. At 100 degC, the applied current density was from 0 A/cm2 to 5times103 A/cm2 and the time from 3...
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