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After surveying the laminate theory, this paper presents a field proven 3-steps concept for modeling printed circuit boards (PCB). First, the behavior of the single plies is studied by means of a 3D detailed model representing a typical cell. Afterwards, the laminate theory is applied to transfer the material data determined in the first step to a 3-layers model, which eventually allows modeling full...
Modal, harmonic and transient simulations have been performed on typical electronic modules consisting of a printed circuit board to which ball grid array (BGA) components are mounted. The BGA solder joints are modeled as continuous layers applying effective values for stiffness and density. This way, the simulation run time was minimized without reducing the accuracy of the targeted global results:...
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