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Ensuring reliability of interfaces of dissimilar materials is one of the most critical design aspects of electronic assemblies. A study on the interface delamination phenomenon of different power packages was undertaken. Thermally induced stresses caused by the thermal mismatch between molding compound (MC), Si-die, and Cu- heatsink act as combined shear and normal loadings on the respective interfaces...
It is well known that high temperature storage can degrade moulding compounds for chip encapsulation to such an extent that the adhesions to surfaces like copper (lead frames) or polyimide (chip coating) decreases drastically causing delamination. During normal operation of electronic components, heat is generated locally (bond wire, or chip surface) degrading the moulding compound and reducing the...
This study presents a multi-disciplinary approach in order to investigate the influence of hygroscopic stresses and stress relaxation in Epoxy Molding Compounds (EMC) on the apparent interfacial fracture toughness of Cu/EMC interfaces. Bi-material beams were designed and produced via transfer molding similarly to the process used in state-of-the-art semiconductor packaging. An empirical method was...
Interfacial adhesion between the Epoxy Molding Compound (EMC) and the copper-based leadframe is one of the major concerns in the qualification of plastic packages. Since the conventional shear testing methods used in industry do not consider the residual stresses in the shear samples, they are only used as a qualitative testing method for the EMC qualifications. However, since these tests are based...
Electrically conductive adhesives (ECA) are popular solutions for joining relatively large (> 500 mum) electrical interfaces or when lower-temperature requirements preclude soldering or brazing. When assembled by squeezing between two flat, rectangular surfaces, the flow dynamics of the conductive filler and matrix can induce variations in local electrical conductance. This becomes significant...
Thermal characterisation of thermal interfaces becomes even tougher a challenge at low bond line thicknesses and higher thermal conductivities of the interface materials as more accurate measurement techniques are required. As in parallel the quest for high conductivity adhesives and greases is ongoing, a correlation between thermal bulk or interface properties and structure is in high demand. We...
The universal applicability of polymeric materials in microsystem technology is based on a wide adaptability of their thermo-mechanical as well as their electric/dielectric characteristics. However, as they are generally sensitive to temperature and moisture, obey a misfit in thermal expansion to other electronic materials, and lack a high mechanical strength they are often the weakest link in packaging...
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