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Two of the most important questions concerning the future of interconnects are 1) how scalable is the damascene process to extremely narrow trenches and 2) what is the resistivity of Cu in these trenches? We attempt to answer both these questions through the generation of high aspect ratio, rectangular cross section trenches as narrow as 20 nm using a novel sacrificial Si FIN process flow. To fill...
Several technological and architectural solutions have been proposed to solve the "interconnect performance bottleneck", such as the use of on-chip transmission lines, carbon-nanotube (CNT) interconnects, wafer-level package (WLP) interconnects, 3D interconnects, RF and microwave interconnects and optical interconnects. It is essential to accurately estimate the interconnect performance...
Since the design of advanced microprocessors is based on simulation tools, accurate assessments of the amount of crosstalk noise are of paramount importance to avoid logic failures and less-than-optimal designs. With increasing clock frequencies, inductive effects become more important, and the validity of assumptions commonly used in simulation tools and approaches is unclear. We compared accurate...
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