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We have inquired further into the interference effect between active circuit and spiral inductors. Through the VCO's integrated with MEMS inductors, we investigated the phase noise characteristics according to inductor's position in circuits. These experimental results were further studied by electromagnetic theory and simulation. We have concluded that the magnetic field induced by inductor have...
Performance enhancements of a microstrip antenna with multiple layer substrates a small size broadband microstrip patch antenna for 5 GHz WLAN applications with multi-layer substrate has been fabricated using MEMS process. A microstrip antenna fabricated on top of silicon substrate can be realized in small size but has limited bandwidth while a microstrip antenna fabricated on top of glass substrate...
The silicon-through-via structure that can withstand high thermal budget of MEMS process is suggested for stacked MEMS package. The doped silicon is used as through- via material instead of metal. The key ideas and design are described in detail. SDB (silicon direct bonding) multi-stacking process and metal reflow technique are used for through-via fabrication. Through-via arrays with 40mum and 50mum...
A novel Si via interconnection technique using the doped silicon as an interconnection material is presented for 3D MEMS package. Concept and key idea of silicon via is described. Two layers stacked via arrays with 40 mum and 50 mum spacing are fabricated to prove its feasibility. SDB (silicon direct bonding) multi-stacking process is used for fabrication of stacked package, which consists of a substrate,...
Three dimensional cultures in a microfabricated environment provide in vivo-like conditions to cells, and have used in a variety of applications in basic and clinical studies. Also, the analysis of the contractility of cardiomyocytes is important for understanding the mechanism of heart failure as well as the molecular alterations in diseased heart cells. This paper presents a realistic computational...
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