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Degradation of adhesion between Cu and epoxy-based dielectric build-up film (EDF), which is used for fan-out wafer level packaging applications, was investigated by the reliability test. The samples were composed of four layers: epoxy molding compound substrate, laminated EDF, electroless Cu, and electrolytic Cu. Adhesion was evaluated by the 90° peel test before and after the temperature and humidity...
We successfully fabricated an eco-friendly Cu-Zn wetting layer for Sn-Ag-Cu (SAC) solders by electroplating in a cyanide-free solution. The reliabilities of solder joints formed on the Cu-Zn solder wetting layer were evaluated through the drop impact test and thermal cycling (T/C) test. First, boardlevel drop impact test was performed with the SAC solder joints formed on electroplated Cu or Cu-Zn...
A 20 μm pitch flip-chip bonding with Sn/Cu bumps and nonconductive adhesives (NCAs) was developed to satisfy the requirement for high density electronic packaging. The Sn/Cu bumps of a 20 μm pitch are peripheral distributed in a line. The bonding process was performed at 150°C for 10 s using three commercial NCAs. All the joints were successfully fabricated with NCAs, and have similar contact resistance...
The excessive growth of intermetallic compound (IMC) and the formation of microvoids in the interface between Sn-Ag-Cu (SAC) solder and Cu substrate have been a serious problem which may degrade the solder joints reliability. Recently, a new Cu-Zn alloy solder wetting layer for the Pb-free solders has been developed to reduce the IMC growth rate. In this paper, the kinetics of IMC growth and the shear...
A chip-on-flex (COF) bonding technology using Sn bumps and a non-conductive adhesive (NCA) was investigated. Two types of Sn bumps, square bumps and hemispherical bumps, were fabricated. The COF bonding was performed at 180degC for 5 s at 90 MPa after the NCA was dispensed. To evaluate the reliability of the COF joints, a high temperature storage test (150degC, 1000 h), thermal cycling test (-25degC/+125degC,...
The intermetallic growth in the Sn-Ag-Cu (SAC) solder joints fabricated on Cu or Cu-Zn solder wetting layer and its effect on the drop impact reliability have been studied. The drop test specimens were fabricated by connecting two printed circuit boards by reflowing SASC 405 solder balls on Cu or Cu-Zn wetting layers. And the drop test specimens were aged at 150degC up to 500 hrs. The well known bi-layer...
We developed a reliable and ultra-fine pitch chip on glass (COG) bonding technique using non-conductive adhesive (NCA). Sn was used as a bump material because it has a high plastic deformation capability and it is cheaper than an Au bump. Sn bumps were formed using photolithographic and electroplating and reflowed to form the half-dome shape. Reflowed Sn bumps were used to reduce the NCA trapping...
We recently developed Cu-Zn alloy wetting layer for the SAC solder balls to improve the reliability. In this paper, IMC formation and solder joint reliability have been investigated in the solder joint between SAC solder balls and Cu-Zn alloy pads, and Cu pads were also used as a reference. Sn-4.0Ag-0.5 Cu solder balls were used and the substrates were Cu and 80 wt% Cu-20 wt% Zn pads which were defined...
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