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Comprehensive analysis of current spreading, temperature distribution, and near-field electroluminescence of high-power “face-up” AlInGaN LEDs and LED Arrays was performed by combination of different experimental methods. Measurement results of thermal impedance and temperature distribution (mapping) of powerful light-emitting diode assemblies are described. A thermal resistance characterization consists...
Thermal resistance and temperature distribution for high-power AlGaInN LED chip-on-board arrays in blue and white versions were measured by different methods and tools. The p-n junction temperature was determined through measuring a temperature-dependent forward voltage drop on the p-n junction, at a low measuring current after applying a high heating current. Furthermore, the infrared thermal imaging...
Comprehensive analysis of current spreading, temperature distribution, and near-field electroluminescence of high-power “face-up” AlInGaN LEDs and LED matrixes been performed by combination of different experimental and methods. A thermal resistance characterization consists in investigations of transient electrical processes in the diode sources under heating by direct current and analysis using...
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