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Cu pumping is a potential reliability issue for through silicon via (TSV) based 2.5D and 3D integration, due to the CTE mismatch between silicon and copper. In this paper, we report the reliability assessment of Cu pumping treated at different annealing conditions. Cu pumping is simulated by finite element method to compare the effect of the overburden layer. The pumping of TSVs having a diameter...
High-speed permanent magnet (PM) brushless DC motors have gained more and more interests for many applications. The technique of detecting the electromotive force (EMF) zero-crossings is a common method in sensorless operation of PM brushless DC motors. However, the zero-crossings of the phase EMF will be obscured and the sensorless control will be malfunctioned, since the free-wheeling diode conduction...
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