Search results for: D. Via
IEEE Electron Device Letters > 2015 > 36 > 10 > 1004 - 1007
physica status solidi c > 11 > 3‐4 > 871 - 874
Journal of Applied Polymer Science > 124 > 3 > 2269 - 2277
Polymer Composites > 33 > 2 > 306 - 316
IEEE Electron Device Letters > 2012 > 33 > 8 > 1126 - 1128
IEEE Electron Device Letters > 2012 > 33 > 3 > 366 - 368
Journal of Applied Polymer Science > 124 > 1 > 182 - 189
Journal of Applied Polymer Science > 121 > 4 > 2273 - 2281
Journal of Applied Polymer Science > 121 > 2 > 1040 - 1051
physica status solidi (a) > 208 > 2 > 439 - 444
IEEE Transactions on Device and Materials Reliability > 2011 > 11 > 1 > 187 - 193
2010 International Electron Devices Meeting > 20.1.1 - 20.1.4
physica status solidi c > 7 > 10 > 2433 - 2435
Journal of Applied Polymer Science > 118 > 5 > 2512 - 2520
Polymer Composites > 31 > 3 > 497 - 506