The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
300W end-pump power deposited as heat is predicted to cause a thermal damage for doped double clad fiber (DDCF). In order to estimate cooling effects of DDCF through radiator, the general equation has been solved with a thermal convection boundary under a rectangular plate at the periphery. Steady-state thermal profiles are developed using both a full numerical solution and an analytic approximation...
With the trend of higher power density, miniaturization as well as higher operating temperature requirement, heat transfer problem has been one of the crucial issues. Microchannel heat sink shows a great potential regarding to the excellent heat dissipation capacity. This paper aims to design microchannel heat sink for high power modules cooling based on topology optimization method to obtain better...
We have developed a novel MOCVD reactor, which is called buffered distributed spray (BDS) MOCVD reactor, for the multiple wafer growth of films of III–V materials. In the present study, a fundamental and multi-field model based on the computational fluid dynamic (CFD) simulation of coupled flow, heat and mass transfer is presented to describe the epitaxial growth of gallium nitride (GaN). It is investigated...
The problem of heat dissipation of high power electronics such as IGBT (Insulated Gate Bipolar Transistors) has puzzled us for long time. If the heat generated from the chips could not be eliminated away from the devices, the failure rate would rise rapidly. To deal with this problem, the micro pumps along with the microchannel embedded in the DBC substrate are proposed to remove the heat actively...
Hall effect based current sensors have strong market demand in many monitoring devices. Enameled wire is the most important part of packaging of the Hall effect based current sensor, and the size of winding area of enameled wire changes the strength of the magnetic induction, which would affect the current sensor's performance. In this paper, we found an optimal area for closed loop Hall effect based...
High power electronic modules, such as IGBT modules, are required in many applications, like the high speed train, solar energy inverter, CNC, frequency-alterable air-conditioner, etc. When a module works, a lot of heat would be generated due to the small size. If the heat could not be removed from the module, the high heat flux might lead to failure of the module. Therefore, a good thermal management...
GaN thin film grown on sapphire substrate of 50 mm*50 mm in size are successfully bonded and transferred onto Si substrate using Au-Sn wafer bonding followed by grinding, chemical mechanical polishing (CMP) and dry etching. The GaN/sapphire structures are integrated to receptor Si substrate by thermal pressure bonding process. The bonding medium comprises Au-Sn multilayer composite deposited directly...
Heat sources on rectangular plate with cooling at both upper and lower surfaces are common in electronic devices. A thermal model for calculating thermal resistance of eccentric heat source on plate with convective cooling at upper and lower surface is presented in this paper. The model was applied for calculating thermal resistance of a plate at three groups of boundary conditions. Simulations for...
Thermal management of a super computer is one key point in the whole system design. The working temperature of electronic device in the super computer is the important parameter to show the cooling performance. Thermal design was conducted for one super computer. The experiment was conducted to test the temperature of an ultrascalable computing platform in order to evaluate the cooling performance,...
In this paper, a microjet-based cooling system is proposed for the thermal management of high-power light-emitting diodes (LEDs). Preliminary experimental investigation and numerical simulation on such an active cooling system are conducted. In the experiment investigation, thermocouples are packaged with LED chips to measure the temperature and evaluate the cooling performance of the proposed system...
In this paper, a micro jet based cooling system for the thermal management of high power LEDs is briefly introduced. Our experiments have demonstrated that the optimization on micro jet device is strongly needed for improving the system performance. To realize the above attempt, numerical optimization on micro jet device is conducted in details in this paper. The comparison between simulation and...
Advancement in high heat thermal management technology and its successful integration into emerging GaN-based amplifiers is imperative to meet the long-term requirement of future X-band radar systems. It is also known that the efficiency and reliability of light emitting diode (LED) strongly rely on successful thermal management due to its inherit low junction temperature in the LED chip. In this...
The efficiency and reliability of solid-state lighting devices strongly depends on successful thermal management. High-brightness light emitting diodes (LEDs), as a strong candidate for the next generation, general illumination applications, were developed by improving luminous efficiency and integrating multi-chips within limited areas. This resulted in the thermal management challenge that is able...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.