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Presented in this paper is a feasibility study of a chip stacking technology for very high bandwidth communication. This technology utilizes transmission line coupling between coplanar differential lines constructed in metal layers of two chips placed facing each other such that the differential pairs are overlapped with a spacing of many microns. In previous study we demonstrated communication at...
In this paper, we introduce a very high bandwidth proximity communication technique for Stacked LSIs. This technology is based on transmission line coupling between two differential pairs in the metal layers of each chip and can be implemented without modifying conventional chip fabrication process. We have demonstrated its feasibility using a single chip in which coupled two differential pairs of...
Interconnection technology using conductive adhesives is generally used in place of solder interconnection. However, it is not clarified whether or not the conductive adhesive joints are adequate to high-speed signal transmission and power supply with large current, because there are not suitable methods for measuring and evaluating performance of the intended electrical function of an electronic...
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