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A novel vertical RRAM for 3D cross-point architecture is proposed. The design and optimization issues of the proposed vertical RRAM for 3D cross-point architecture array are addressed from both device and array levels. A double layer stacked HfOx based vertical RRAM devices with interface engineering fabricated using a cost-effective fabrication process. The excellent performances such as low reset...
Stacked HfOx based vertical RRAM with interface engineering for 3D cross-point architecture is fabricated using a cost-effective fabrication process. The excellent performances such as low reset current, fast switching speed, high switching endurance and disturbance immunity, good retention and self-selectivity are demonstrated in the fabricated HfOx based vertical RRAM devices. The scaling limit...
For the first time, we report that the resistive switching behaviors of the multi-level resistance states can be influenced by the operation mode. Simulations reveal that this is due to the different geometry of the conductive filament in the multi-level resistance states stemmed from the different operation mode. Based on this understanding, improved stability and uniformity of the medium resistance...
Both unipolar and bipolar resistive switching behaviors are demonstrated and investigated in the TaTiN/HfOx/Pt structured RRAM devices. A physical model based on the recombination among the electron-depleted oxygen vacancies (VO2+) and the oxygen ions (O2-) released from the TaTiN electrode is proposed to clarify the co-existed bipolar and unipolar resistive switching effect. In the proposed physical...
CMOS compatible Cu/SiO2/TiN-based resistive random access memory (RRAM) was fabricated and investigated. Unique self-compliance unipolar resistive switching (RS) was observed, as well as good retention and uniformity of resistance states. A physical model based on formation and rupture of Cu conductive filament (CF) is proposed, considering both thermal and electrical effect, and verified by experiments.
We report, for the first time, three types of endurance failure behaviors in TMO based RRAM. New physical mechanisms are proposed to clarify the physical origins of these endurance failures. A physically-based optimized switching mode is developed to improve the endurance of TMO-RRAM. A significantly enhanced endurance of >109 switching cycles was demonstrated in the HfOx/TiOx/HfOx/TiOx devices.
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