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This paper investigates the use of adhesive bonding on polymeric microfluidic devices. Both pressure sensitive and UV curable adhesives have been studied. Characterization tests conducted include flow, pressure and 180?? peel tests. All the five adhesives are able to pass the flow and pressure tests. Pressure sensitive adhesives generally perform better than UV curable adhesives in the peel tests...
We attempted ultrasonic welding as a technique for the bonding of connectors to microfluidic devices. Different schemes of the method were explored based on different designs of the connectors to achieve a strong, minimal dead-volume connection. Results showed that without the use of inserts, there would be unwanted flow of melt material into the conduit of the connector causing blockage. With the...
We present a study on the use of corona discharge surface treatment to achieve a fast thermal diffusion bonding process for the creation of microfluidic chips. Wafer level bonding at 100 mm diameter was attempted. Polymethyl methacrylate (PMMA) wafers were hot embossed to create microchannels before bonding to another blank PMMA wafer. Corona discharge treatment of the PMMA resulted in a more hydrophilic...
The integration of a PDMS membrane within orthogonally placed PMMA microfluidic channels enables the pneumatic actuation of valves within bonded PMMA-PDMS-PMMA multilayer devices. Here, surface junctionalization of PMMA substrates via acid catalyzed hydrolysis and air plasma corona treatment were investigated as possible techniques to permanently bond PMMA microfluidic channels to PDMS surfaces. FTIR...
We report on the hot roller embossing of polymer sheets for the creation of microfluidic structures. Measurements conducted on 100 mum features showed that the lateral dimensions could be replicated to within 2% tolerance, while over 85% of mould depth was embossed. Feature sizes down to 50 mum and feature depths up to 30 mum had been achieved. At lower temperatures, asymmetric pile up of polymer...
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