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Two on-chip electromagnetic compatibility (EMC) solutions realized in the standard 0.18 μm CMOS technology are proposed. A slew rate controller for electromagnetic interference (EMI) reduction is demonstrated by increasing the rise and fall time of signal to lower the harmonic energy on FFT spectrum. Besides, a MOS plus MOM decoupling capacitor for both EMI and electromagnetic susceptibility (EMS)...
IC-EMC has been taken care and developed on the decade. Some standards about EMC and radiated emission were stipulated. However, in integrated circuits, no rules or specified information can support the method of EMC suppression. According to the EMC standard, this paper proposed the radiated emission measurement of different bonding type in the integrated circuit and different substrate design with...
This paper studies software-related microcontroller's conducted electromagnetic interference (SW-cEMI) behaviors when microcontrollers are executing different programs of the same functionality. The SW-cEMI behaviors of different program types, clock sources, and programmable PLL settings are measured and observed. Two major trends of microcontrollers are used as devices under test. The result shows...
With the advance of semiconductor and wireless communications technologies in recent years, the systems of highly integrated high-speed digital circuits and multi-radio modules have paved the way to mobile communications and networking. While notebook computers become more and more powerful in all respects, many RF modules such as Wi-Fi, Bluetooth, WWAN with GSM and WCDMA have been put together inside...
According to CISPR 16-1 & ANSI C 63.4 standard requirements, to implement EMI radiated emission measurement needs to use accuracy antenna factor (AF). The Standard Site Method(SSM) of antenna calibration is most popular technology in the EMI sector. In Taiwan, the SSM calibration technology is also to set up in BSMI WUDA Antenna Site to calibrate broadband antennas (30 MHz to 1 GHz). This paper...
In this paper, simplified models and simulation of radiated far-field emission from a printed circuit board (PCB) are discussed. Furthermore, a study of radiated far-field emission for an equivalent PCB model is presented. The behaviour between simulated far-field EMI spectra and experimental results keeps the same trend.
In this paper, we investigated the electromagnetic bandgap structure (EBG) is embedded in a multi-layer board to mitigate EMI in an adjacent board. The design of the new EBG structure proposed here relies on the modification of thin lines and patches. The thin lines serve to provide the equivalent inductances. Simulation results can suppress any frequency band noise effectively.
A novel electro-optical magnetic microsensor with reducing interference packaging mechanism for sensing magnetic field strength is demonstrated. Both capacitive and optical fiber sensing microstructures surrounded magnetic shields are fabricated in a chip using low temperature silicon-based MEMS compatible technology. Varied NiFe permalloy flaps embedded on polyimide membranes were used as flexible...
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