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Through Silicon Vias (TSV) is a very promising technology in advanced packaging, for the replacement of wire bonding. This technology is becoming mandatory for fully integrated products such as SiP, SoP, 3D components integration (e.g memory stacking), or MEMS structure packaging. Different alternatives are currently investigated such as via-first or via-last. Into the via-first family two different...
Through Silicon Via (TSV) is a one of the more important bricks for 3D stacking and offer different integration approaches. The via-last approach has been first introduced into production. Yet the via-first approach is also currently actively investigated since it has some advantages particularly the use of high conformal deposition materials for isolation and filling of the TSVs enabling higher density...
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