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This study focuses on the development of a low cost and very fine pitch (8μm space/8μm line width) Redistribution Layer (RDL) for a 3D silicon interposer built on 300mm wafers, including a fine pitch-compatible conformal passivation. The first part of this paper describes the development of all the process steps involved in the conventional RDL build-up, with a focus on low temperature compatibility...
Through Silicon Vias (TSV) is a very promising technology in advanced packaging, for the replacement of wire bonding. This technology is becoming mandatory for fully integrated products such as SiP, SoP, 3D components integration (e.g memory stacking), or MEMS structure packaging. Different alternatives are currently investigated such as via-first or via-last. Into the via-first family two different...
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