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The purpose of this study is to investigate the mechanical behavior of Sn-Ag-Cu solder joint under high speed shear test. A impact testing method with shear rate up to 1.0 m/s was set up to measure the solder joint reliability. The effects of differential substrate pad opening and pad metallization were also considered. The study focuses on failure mode analysis and examines characterizing strengths...
The most common cause of failure in portable electronic products is accidental drop. Therefore, the effect of impact on electronic package is very important. This study examines the mechanical behavior of lead-free solder joints under high speed shear. In this research we will set up the high rate ball shearing impact test, the maximum impact speed can up to 1.0 m/sec. The effects of differential...
The aim of this research is to investigate the mechanical behavior of lead-free solder for high speed impact. A high speed impact test was set up to measure the solder joint reliability. Differential impact speed and room temperature aging effect has been studied with Ni/Au substrate. Furthermore, two different solder alloys (96.5Sn-3Ag-0.5Cu, 98.5Sn-1Ag-0.5C) and three different reflow profiles are...
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