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We present a methodology for the formulation of percolating thermal underfills (PTUFs) with enhanced thermal conductivity for efficient heat dissipation between dies in 3D chip stacks. The methodology is based on the centrifugal filling of micron-sized powders in a confined space (defined by a solder ball array) to form a percolating particle bed, and on the formation of enhanced thermal contacts...
Ever increasing device density in electronic chips is beneficial for enhancing their computing efficiency. However, it also introduces severe challenges with respect to cooling solution which are indispensible for ensuring a reliable chip operation. Such steady miniaturization will soon render the traditional air cooling strategies futile and make the switching to liquid cooling inevitable. Superior...
In this work, we study the impact of the phonon thermal conductivity of Silver (Ag) and Gold (Au) on the interface resistance of metal-nonmetal contacts at room temperature. The thermal conductivity of both metals is determined for bulk and thin films of varying thickness using non-equilibrium molecular dynamics (NEMD) simulations. Likewise, we determine the thermal interface resistance due to phonons...
<para> We report on a simple method to improve bondline formation kinetics by means of a hierarchical set of channels patterned into one of the surfaces. The channel arrays are used to improve the gap squeezing and cooling of single and multiple flip-chip electronic modules with highly viscous fluids and thermal pastes or greases. They allow a fast formation of thin gaps or bond lines by reducing...
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