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A very new interconnection method, namely Cu lateral interconnection is proposed and tested for the heterogeneous multi-chip module integration in which MEMS and LSI chips are self assembled onto the flexible substrate. Here, the lateral interconnects runs between a few hundred microns thick chip and the Si or flexible substrates as well as at inter chip level. These Cu lateral interconnects were...
We have proposed the intelligent Si neural probe system which can realize high density and multifunctional recording of neuronal behaviors. In this device, LSI chips such as amplifiers, A/D converters, and multiplexers are integrated on the intelligent Si neural probe. In this paper, we report the development of a novel Si neural probe with microfluidic channels which is the key part of the intelligent...
We have newly proposed heterogeneous multi-chip module integration technologies in which MEMS and LSI chips are mounted on Si or flexible substrates using a self-assembly method. A large numbers of chips were precisely and simultaneously self-assembled and bonded onto the substrates with high alignment accuracy of approximately 400 nm. Thick MEMS and LSI chips with a thickness of more than 100 mum...
We proposed a new three-dimensional (3-D) super-chip integration technology using self-assembly technique. Many chips are simultaneously aligned and bonded onto lower chips using a self-assembly technique in a super-chip integration. It was confirmed that Si chips with sizes of 1 mm square to 5 mm square were precisely assembled on Si wafers with high alignment accuracy of less than 0.5 ??m. We have...
Objectives: The purpose of this study was to evaluate the effect of acidic primers on bonding between methacrylic resins and SUS 316 stainless steel.Methods: The primers were single liquid metal conditioners containing either a phosphate monomer (Cesead opaque primer, CO; Metal primer, MP) or a carboxylic monomer (Super-Bond liquid, SB; Acryl bond, AB; MR bond, MR). Disk metal specimens were air-abraded...
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