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An efficient analysis of the capacitive via-plate coupling in multilayer printed-circuit board (PCB) structures is presented. The quasistatic solution for the via-plate capacitance is determined as the solution of Laplace's equation for the static electric potential within the via-plate region, which is electrically small for a large frequency range. The final capacitance solution can be obtained...
A numerically very efficient simulation method for the analysis of arbitrarily shaped power-bus structures on printed-circuit boards is presented. It is based on a 2D contour integral-equation method in combination with a subsequent macromodeling step, for simulation in time- and frequency domain. For this purpose a vector-fitting approach is applied, yielding a SPICE-compatible equivalent circuit...
The application of a 2D contour integral-equation method in the frequency domain for the simulation of arbitrarily shaped power-bus structures is presented. It allows the calculation of the voltage/current responses between an arbitrary numbers of ports, which may be used for circuit level simulations of a populated board. The presented numerical approach is also capable to provide the frequency dependence...
This paper presents a novel concept for time- and frequency-domain modeling with the PEEC method (DGFPEEC), which is based on the mixed potential integral equation (MPIE) with dyadic Green's functions. Such models provide exact full-wave semi-analytical solutions for an arbitrary interconnection system, on the other hand, they are represented in a circuit form and, thus, can be implemented in common...
This paper presents a novel time- and frequency-domain concept of modeling with the partial element equivalent circuit (PEEC) method, which applies the mixed potential integral equation (MPIE) with dyadic Green's functions for layered media (DGFLM-PEEC). On the one hand, it represents an exact full-wave semianalytical solution for an arbitrary configuration of traces and via holes in multilayered...
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