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Large 6 mm times 9 mm silicon dice have been successfully bonded on alumina substrate with electroplated Au80Sn20 eutectic alloy. Eutectic AuSn is one of the best known hard solders having excellent fatigue-resistance and mechanical properties. A fluxless bonding process in 50 militorrs of vacuum environment is presented. Vacuum environment is employed to prevent tin oxidation during the process....
A fluxless bonding process between silicon and copper with high-temperature Ag-Sn joint is developed by low temperature bonding using Ag-Sn-Au multilayer composite structure. The copper substrate is plated with a thick silver layer as stress buffer. We bond 5mmtimes5mm silicon chips onto Ag/copper substrates using electroplated lead-free Ag-Sn-Au solder. Si chips were produced with two different kinds...
We report a wafer-to-wafer bonding technique with solder as the bonding layer but without the use of any flux. This fluxless or flux-free feature makes void-free and uniform bonding layer possible. If flux were used as in the case of typical soldering processes, the flux or flux residues could be easily trapped in the joint, resulting in voids and uneven solder layer. Flux residues, if not completely...
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