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The reduction of post annealing temperature for plasma activated dielectric bonding was achieved by using SiCN as dielectrics layer. The SiCN-SiCN bonding shows higher bond energy at 250 °C as compared to conventional SiOi-SiOi bonding. The surface and interface of the SiCN bonding dielectric layers were characterized by various quantitative and qualitative methodologies. This alternative bonding...
Plasmas have been utilized extensively in various processing applications. Both radio-frequency (rf) and pulsed discharges have been employed by the community. We investigated the two methods of plasma generation and observed interesting differences. Optical emission spectroscopy shows higher-intensity emission in the UV/visible range for the pulsed plasma comparing to the rf plasma at comparable...
One of the major area of interest of the electronics packaging industry is the formation of interconnects between the chips in a 3D package. Copper has been proven to be a suitable candidate for the conductive material in back-end-of-line due to its low electrical resistivity and high electro-migration resistance. Due to this favorable property of copper, it is also used to form microbumps and through...
The introduction and use of ultra low-k dielectric materials in an attempt to achieve better die performance brought new challenges to the wafer singulation / dicing process. Ultra low-k dielectric materials can easily get damaged during conventional blade dicing due to their brittleness. Thus, there is a need to investigate alternative or more advanced dicing techniques that can deliver successful...
Spectral analysis of the vacuum conditions within the JET tokamak provides unique challenges due to the complex interactions of Hydrogen, Deuterium and Tritium with the large amounts of Carbon forming the plasma facing first wall. Overlapping masses and low resolution of the quadrupole Residual Gas Analyzer (qRGA) means discrimination of individual species is not possible operating in a conventional...
Two variations of an intense ion beam diode having magnetic insulation generated either by an external capacitor bank (radial ion diode) or by diode curent passing through coil-like vanes, (AMPFION) are described. Advantages in energy delivery and focusability make AMPFION the best candidate for attaining ignition.
A number of recent ion diodes have employed series magnetic field coils to provide electron insulation. These coils are designed to provide uniform magnetic field at the anode. This feature allows the diode to be modeled by analytic theory. When combined with PIC computer simulations, the design process can be carried on with high confidence. Much of the theory can be used qualitatively and semi-quantitatively...
ICF reactors [1] have been proposed which incorporate a gas-filled chamber to reduce x-ray and debris loading of the first wall. Focused beams of either electrons or ions must be transported efficiently for 2–4 m to a centrally located fusion target. Laser-initiated current-carrying plasma discharge channels provide the guiding magnetic field and the charge- and current-neutralizing medium required...
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