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The joint strength of Sn37Pb, Sn-lAg-0.5Cu (SAC105), Sn-3Ag-0.5Cu (SAC305) and Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga (SnZn-5e) solder joints on Au/Ni/Cu and OSP/Cu metallization were investigated with micro-impact test. All solder joints exhibit bulk and interfacial fracture modes except Sn37Pb of which fracture only occurs in the bulk. The impact resistance is governed by strain rate. Sn37Pb, SAC105 and SnZn-5e...
The most common cause of failure in portable electronic products is accidental drop. Therefore, the effect of impact on electronic package is very important. This study examines the mechanical behavior of lead-free solder joints under high speed shear. In this research we will set up the high rate ball shearing impact test, the maximum impact speed can up to 1.0 m/sec. The effects of differential...
The most frequent failure of movable electronic products is an accidental drop to the ground. Therefore the effect of impact on electronic package is very important. This paper aims to study the mechanical behavior of lead-free solder joint under high speed impact. A series of experiments is conducted to study the effect of impact velocity and room temperature (R.T.) aging. All experiments were performed...
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