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3D multi-layer chip stacking is a significant assembly challenge with dependencies on die size and thickness, interconnect pitch, bump diameter, number of dies involved, and die warpage. The assembly processes used to overcome the technical difficulties associated with the stacking of medium and large logic dies with fine pitch copper pillar bumps is discussed, including mass reflow and thermo-compression...
To evaluate the association between HDL particle size measured by gradient gel electrophoresis and risk of incident coronary heart disease (CHD) in apparently healthy men and women.We performed a prospective case–control study nested in the EPIC-Norfolk cohort. Cases were apparently healthy men and women aged 45–79 years who developed fatal or nonfatal CHD (n=1035). They were matched to 1920 controls...
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