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With the rapid developments of electronic packaging, there is an increasing demand on high performance isotropic conductive adhesives (ICAs). However, the traditional ICAs are brittle, sensitive for crack formation and delamination, which is one of the major drawbacks that limits their use in a wide range of applications. Therefore great efforts have been made to make conductive adhesives more flexible...
Heat dissipation of electronic packages has become one of the limiting factors to miniaturization. The removal of the heat generated is a critical issue in electronic packaging. With the development of thermal management, thermal interface material (TIM) plays a more and more important role in electronics packaging. A new nano-TIM with nanofibers prepared by using electrospinning has been suggested...
Thermal management in electronics packaging is becoming more rigorous with the increase of IC power. A common method is to transfer heat from the heat generating devices using a heat dissipation member, for example heat sink. Thermal interface material (TIM) is applied between the heat source component and the thermally conductive member to offer a fast heat dissipation path. Nano thermal interface...
Organic light emitting diodes (OLEDs) is one of the most potential display technologies in the flat panel display (FPD) field, and its applications include simple monochrome large-area lighting to full color, video-capable graphics displays and so on. As organic materials are susceptible to humidity and oxygen, encapsulation is a key issue for OLED device reliability. In the present paper, two kinds...
Heat dissipation of semiconductor packages has become one of the limiting factors in miniaturization. A new Nano Thermal Interface Material (Nano-TIM) with potential high thermal conductivity and excellent mechanical properties manufactured by electrospinning process has been published earlier. In the present work, SiC nano-particles were added into the electrospinning solution to improve the thermal...
Anisotropic conductive adhesive (ACA) technology is one of the most important technologies for interconnect of electronics hardware. During the last 20 years, tremendous research and development effort has been spent on this. The purpose of this paper is to present ontology of the publications within the ACA technology since 1980. The following search fields are used for this study: ACA/ACF on glass,...
The adhesion of copper/liquid-crystalline polymer bilayer lamination structures with various thickness fabricated with chemical electroless copper deposition (CECD) and surfaced activated bonding (SAB) were characterized mechanical shear-off tests. The influence on the surface morphology and chemical state during different processes, including sulfuric acid bath, heat treatments, plasma treatments...
The need for faster, smaller, and more reliable and efficient products has resulted in increase of heat generated in microelectronic components. The removal of the heat generated is an important issue in electronic packaging. The present research work aims at developing a new class of nano-thermal interface material (nanoTIM) that has low thermal resistance, high thermal conductivity and mechanical...
Liquid crystal polymer (LCP) materials are considered to be promising substrates for RF-applications. In this work, the high frequency characteristics of LCP were investigated using a microstrip ring resonator. The purpose is to verify the possibility of the application of the material in RF packaging. The metallization of LCP was studied for the purpose of board fabrication. The adhesions between...
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