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The critical current (Ic) of epoxy impregnated YBCO coil is prone to degrade due to the cumulative radial tensile stress. Winding tension has the advantage to reduce the amount of epoxy resin and decrease the radial tensile stress during cool down process. In this paper, the dry and wet coils wound on copper and polytetrafluoroethylene (PTFE, Teflon) bobbin materials with various winding tensions...
The dimensions of copper through-silicon vias (Cu-TSVs) have been shrunk to a microscopic scale, where the sizes of the copper grains are comparable to the vias, and thus the microstructure of the copper in the vias should be taken into consideration for reliability predictions. This paper focuses on the influences of the grain size distributions on the thermal-mechanical behaviors of the TSVs. Copper...
Using self-alignment photolithography and copper electroforming techniques, we have developed a size of 1mm×1mm high power GaN-based violet LED embedded in a reflective cup-shaped copper heat spreader. The packaged LED chip sample with copper heat spreader driven at 1 A current yield the light output power of 310 mW, about 1.55 times to the conventional LED. Moreover, the power efficiency is remarkably...
We present the results of study on the manufacturability and reliability of ALX211 polymer in wafer level packaging processes and structures. Previously, the processing windows of ALX211 polymer and the impact of the delays between processing steps on the stability of the process were studied. In this paper, we present a new method to achieve high resolution using ALX211, by putting a certain period...
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