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Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in 3DICs, and the higher temperatures increase delay and leakage power, potentially negating the performance improvement. Thermal vias can help to remove heat, but they create routing congestion, which also leads to longer interconnects...
3DICs are motivated by the expectation of better performance over their 2D counterparts; however, non-idealities threaten to diminish the benefit of multiple tiers. Previous work has predicted the benefit of 3DICs, but have not taken into account the increased temperature and leakage power. This work develops an automated design flow with 2D CAD tools to design 3DICs with the MIT Lincoln Lab 0.18mum...
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