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Based on the requirement of IPD RF SIP application, the silicon based inductor and capacitor and rules have been studied at first. Meanwhile, a two-order silicon-based 2.4GHz bandpass filter with the size of 1.8mm*1.8mm was obtained by the combination of inductances and capacitors. The insertion loss at 2.4GHz is −1.35dB. Furthermore, to improve the selective of the bandpass filter, one transmission...
Via last TSV (through silicon via) technology is more and more applied in 3D WLCSP, which can decrease package volume and increase I/O density. The process of via last includes temporary bonding, grinding, photolithograph, silicon etching, SiO2 etching, CVD, PVD, plating and so on. Silicon etching and SiO2 etching are important process of via last TSV package for interconnect technology. Temporary...
Flip chip package has matured significantly over the past several years, shifting from conventional eutectic Sn-Pb solder bump to Pb-free interconnection. It has become the preferred package solution for high performance IC and microprocessor device. From the last decade, there has been a significant focus on the development of Cu pillar bump interconnection in flip chip package which could meet current...
As data rates and densities in networks have increased, Silicon Photonics has emerged as a primary enabler for upcoming high-speed interconnect applications. We discuss Luxtera's opto-electronic integration approaches that efficiently tackle these new requirements, including both monolithic and hybrid techniques
Flip chip has become the preferred package solution for high performance IC and microprocessor device [1]. In the area of flip chip, advanced Si node is always the mainstream technology. The integration of highly fragile ELK inner layer dielectric (ILD) material plays an important role to reduce the circuit delay time.
We demonstrate low-loss fiber-to-chip coupling using 7.3 μm long silicon strip waveguide cantilever couplers. Average coupling losses are measured to be less than 0.62 dB per connection throughout the optical telecommunications C band.
We demonstrate vertical chip-to-chip light coupling using silicon strip waveguide cantilever couplers. A chip-to-chip coupling loss of 2.5 dB per connection is measured for TE polarization at 1550 nm wavelength.
We demonstrate low power optical bistability in a free-standing silicon ring resonator. The transmission exhibits hysteresis for 80 µW pump power, which is over an order of magnitude lower than similar unreleased ring resonators.
We demonstrate fiber-to-chip cantilever couplers that enable access to photonic devices on a chip surface without dicing or cleaving. Coupling efficiencies of 1.6 dB (TE) and 2 dB (TM) are achieved.
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