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On-chip integration of microfluidic devices are of great importance for analytical and bio-analytical applications1, 2. In this study, a “lab on chip” integrated micro glass microfluidic system based on the Micro-electromechanical System (MEMS) technology will be proposed including the fabrication of CFP process of a resonator and assembly of the on-chip system. The fabrication of the microfluidic...
A wafer-level processing technology that is used to precisely fabricate regular arrays of deep cavities in a Pyrex 7740 glass wafer is presented by silicon molding and vacuum anodic bonding. The fabrication process is based on etching cavities in silicon, followed by vacuum anodic bonding of a glass wafer to the etched silicon wafer. The bonded wafers are then heated inside a furnace at a temperature...
Hermetic or vacuum packaging to maintain a controllable cavity pressure and low costs are required by many MEMS devices having moving parts. A novel fabrication technology using micro glass cavities for wafer level hermetic MEMS packaging including accelerometer or gyroscope will be presented. The micro cavities were fabricated by a hot-forming process using Pyrex 7740 since its coefficient of thermal...
To improve the image resolution of thermal imagers, which image objects by uncooled Focal Plane Arrays (FPAs) made up of two-dimension Infra-red (IR) detector arrays, detector size is decreased, and this results in the reduction of detector IR absorber area . However, reduction of IR absorber area may affect IR detector's sensitivity accordingly. In order to reduce the detector size without reducing...
A novel foaming process to fabricate wafer-level micro glass objects including bubbles and runners for MEMS packaging was studied. Firstly shallow cavities were wet etched fast on the surface of a silicon wafer. CaCO3 powders were placed in the silicon cavities. Then the cavities were sealed with a glass wafer by anodic bonding. The bonded wafers were then heated up, and the gas released by CaCO3...
Hermetic or vacuum packaging to maintain a controllable cavity pressure and low costs are required by many MEMS devices having moving parts. In this paper we propose a hot-forming process of fabricating micro glass cavity arrays for wafer-level and hermetic packaging of MEMS. First, the principle of the hot-forming process was discussed. Then, the hot-forming process for preparing cavity arrays in...
A new wafer-level process to precisely fabricate regular arrays of deep cavities on the Pyrex7740 glass wafer as well as applications to wafer-level hermetic packaging of MEMS devices are presented. The process is based on the anodic bonding, and the Si substrate is employed as a mold layer to form the shape of the cavity. The appropriate processing parameter is obtained from a series of experiments...
In the field of manufacturing of micro-system, the Pyrex7740 glass is a widely-used material since its coefficient of thermal expansion is similar to that of silicon and it has good optical performance for optical sensors and actuators. The use of Pyrex7740 glass is limited by its isotropic etching characteristic. In this paper, a new wafer-level process to precisely fabricate deep cavities on the...
In the domain of manufacturing and packaging of micro-system, the Pyrex7740 glass is a widely-used material since its coefficient of thermal expansion is similar to that of silicon, and its good optical performance for biosensors and optical sensors. But the use of Pyrex7740 glass is limited for its isotropic etching characteristic of tradition micro-machining. In this paper, we present a new process...
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