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The solders used for this study are Sn2.5Ag0.8Cu doped with 0.03 wt.% Fe, Co, or Ni and 0, 0.005, 0.01, 0.06, or 0.1 wt.% Ni. Reaction conditions included multiple reflows for up to 10 times and solid-state aging at 160degC for up to 2000 hrs. In multiple reflow study, Cu6Sn5 was the only reaction product observed for all the different solders used. Reflows using the solder without doping produced...
Sn-Ag-Cu alloys are considered to be the most promising lead-free alloy systems in packaging industry. However, it required the addition of minor alloy elements to improve the properties of the SnAgCu solders to pass various reliability tests and Zn is one of the candidates for the elements. In this study, the effects of Zn content and solder volume on the interfacial reaction will be explored. Experimentally,...
In electronic packaging, the dissolution of the Cu layer of the under-bump metallizations or surface finishes during reflow is one of the most important processing concerns. Therefore, the objective of this study is to investigate in depth the dissolution of Cu into SnAgCu solders with various Cu concentrations. The effect of solder volume on dissolution rate will also be studied. In this study, solder...
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