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There are several identified failure mechanisms such as void formation and propagation, the local melting mechanism and the underbump metallization (UBM) dissolution in flip chip solder joints. In our previous studies Ni(V) UBM consumption was also found to cause the failure. The flip chip solder joint used in this study was with Al/Ni(V)/Cu UBM on the chip side and an Au/Ni surface finish on the...
The solders used for this study are Sn2.5Ag0.8Cu doped with 0.03 wt.% Fe, Co, or Ni and 0, 0.005, 0.01, 0.06, or 0.1 wt.% Ni. Reaction conditions included multiple reflows for up to 10 times and solid-state aging at 160degC for up to 2000 hrs. In multiple reflow study, Cu6Sn5 was the only reaction product observed for all the different solders used. Reflows using the solder without doping produced...
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