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This paper presents a novel hot film wind sensor operating in Thermal-Balanced (TB) mode for the meteorological applications. The sensor is composed of four Constant Temperature Difference (CTD) elements, and each of the elements includes one heater and one temperature detector. The four CTD elements have been designed and implemented to heat the chip and keep itself at a constant overheat temperature...
A CMOS compatible two-dimensional thermal wind sensor, which can measure the wind speed as high as more than 40m/s, was presented by using au-au bonding technology for wafer-level packaging. A ceramic chip, whose front side exposed to the airflow works as the temperature sensing surface, was adapted to protect the temperature sensing silicon chip, while au bumps were used to achieve the thermal interconnection...
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