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This study explores and compares two new alloys, namely 50In-50Bi and 17Sn-26In-57Bi (wt%), with melting peak temperatures of 95 and 82°C, which are substantially lower than the melting points of lead-free solders commonly used for low-temperature applications. The microstructures and intermetallic compounds (IMCs) of the new alloys, which were reflowed on Cu substrates, were studied. Notable Bi3In...
For several years, an approach to use fine-pitch flip chip package (<150um) with copper pillar/ microbump is for the realization of 2.5D/3D packages of higher density and performance enhancement. Generally, flux is widely used to clean the surfaces to be soldered for good wetting and form reliable joints. The upcoming concerns about fluxes are clean-ability for fine-pitch package, voiding and compatibility...
In advanced 3D IC assembly, one of the key processes is to thin down the wafer for multiple-layer stacking vertically. Warpage is commonly seen in the IC chips due to the differences in coefficient of thermal expansion of the materials. The conventional peak temperatures for reflowing Sn-base Pb-free solders are above 230 °C. High temperature thermal processes would further induce severe warpage issues...
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