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The crossbar array architecture with resistive synaptic devices is attractive for on-chip implementation of weighted sum and weight update in the neuro-inspired learning algorithms. This paper discusses the design challenges on scaling up the array size due to non-ideal device properties and array parasitics. Circuit-level mitigation strategies have been proposed to minimize the learning accuracy...
Power delivery network (PDN) design is one of the most critical challenges in 3D Integrated Circuits (IC) design. In existing studies, to ensure the robustness of the 3D PDN, the number of TSVs was always increased inefficiently to mitigate the IR-drop and power noise. However, the overhead for connections is a crucial obstacle to the development of 3D ICs. Consequently, an efficient TSV topology...
Three dimensional integrated circuits (3D ICs) are currently being developed to improve existing 2D designs by providing smaller chip areas and higher performance and lower power consumption. However, before 3D ICs become a viable technology, the 3D design space needs to be fully explored and 3D EDA tools need to be developed. To help explore the 3D design space and help fill the need for 3D EDA tools,...
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