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Silicon front-end and assembly and packaging technology more and more merge. In addition interconnect density reaches limits for advanced CMOS technology. In this paper we introduce the fan-out embedded wafer level packaging technology, which is an example to link front-end and packaging technology and offers additional freedom for interconnect design. We demonstrate capabilites for system integration...
A 0.13μm CMOS chip is fabricated with eight resonator-amplifiers to demonstrate a highly integrated gravimetric sensor based on an FBAR oscillator. The oscillator is attached via flip-chip bonding to a CMOS resonator. Each active 1.86GHz oscillator draws 27mA from a single 17V supply for 200×200μm2 sensors. The resonance frequency shifts by 5MHz in ethanol and 7.3MHz in water and jitter is <3kHz
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