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Stress is a known contributor to various forms of disease in humans and animals, although mechanisms are still unknown. In animals, psychosocial stress‐induced depression/anxiety phenotypes are coincidental with increased inflammation in both brain and blood. The authors recently showed that a novel treatment with a select bioactive polyphenol preparation promotes resilience to stress‐mediated...
Based on the field failure mechanisms in smart electrical energy meters, field operating abnormal data and maintenance data were analyzed. Discrimination analysis for field data was screened for predicting residual life. Through thoroughgoing analysis, field failure data, failure modes, failure mechanisms and external inducing stresses as well as their features with time were analyzed. Then the degradation...
This paper presents a method for analysis of stress and strain of gas pipelines under the effect of horizontal catastrophic landslides. A soil spring model was used to analyze the nonlinear characteristics concerning the mutual effects between the pipeline and the soil. The Ramberg–Osgood model was used to describe the constitutive relations of pipeline materials. This paper also constructed a finite...
Claw rotor profiles greatly influence the performances and applications of claw vacuum pumps. This paper proposes a novel circular arc claw rotor profile, in which circular arcs are employed instead of cusps; and obtains the changing rules of claw rotor profiles varied with the value of circular arc radius. Numerical simulation of gas flow in the working process of claw vacuum pumps is carried out,...
In this study, the drop test simulation for a typical stacked memory device with 8 units integrated vertically on board-level was performed by finite element method. The units were connected with each other through copper lead frames and assembled on the PCB by pins. The computational model of the device was built in ANSYS and the drop test of this board-level assembled device was investigated by...
The stacked memory device that combined eight single memory units in the vertical direction was investigated in this study when the device was subjected to the random vibrations. The fine computational model of the stacked memory with eight units assembled on board-level was built by ANSYS. The modal analysis was carried out first. By applying the power spectrum according to the GJB-548B standard,...
ULSI circuits are constantly improved by continuous scaling down the character sizes. Copper connections and the ultralow-k (ULK) materials as inter-layer dielectrics (ILD) and inter-metal dielectrics (IMD) were implemented. Therefore, the chip package interaction (CPI) becomes critical due to the mechanical properties deteriorate of ULK with high porosity. The reliability of ULK layer may be affected...
The stacked memory device that combined eight single memory units in the vertical direction was investigated in this study when the device was subjected to the random vibrations. The fine computational model of the stacked memory with eight units assembled on board-level was built by ANSYS. The modal analysis was carried out first. By applying the power spectrum according to the GJB-548B standard,...
In this study, the drop test simulation for a typical stacked memory device with 8 units integrated vertically on board-level was performed by finite element method. The units were connected with each other through copper lead frames and assembled on the PCB by pins. The computational model of the device was built in ANSYS and the drop test of this board-level assembled device was investigated by...
ULSI circuits are constantly improved by continuous scaling down the character sizes. Copper connections and the ultralow-k (ULK) materials as inter-layer dielectrics (ILD) and inter-metal dielectrics (IMD) were implemented. Therefore, the chip package interaction (CPI) becomes critical due to the mechanical properties deteriorate of ULK with high porosity. The reliability of ULK layer may be affected...
In the Chinese labor market, the peasant workers employment problem is the social big problem. In recent years, new generation peasant workers replace the old, making great contribution for urban construction. Whereas, thousands of peasant workers come into city, leading to peasant workers are more than work. Employment problem make new generation peasant workers produce huge psychological pressure...
Through silicon vias (TSVs) have been extensively studied because it is a key enabling technology for achieving three dimensional (3D) chip stacking and silicon interposer interconnection. The large mismatch between the coefficients of thermal expansion (CTE) of copper and silicon induces stress which is critical for the TSV reliability performance. This paper proposes analytical solutions of stress...
The 3D IC integration technology may achieve high performance, better reliability in electronic applications. Since the through silicon via (TSV) provides the key connection in 3D IC integration, the reliability issues of TSV are very important. In the TSV architecture, the electroplating copper is filled in the TSV. As the difference of coefficient of thermal expansion (CTE) between silicon and copper...
Fourier transform infrared was used to investigate physiological changes in the chemical composition of roots, stems and leaves of Chenopodium ambrosioides L. amended with different manganese concentrations(5, 200, 500, 2000, 5000, 10000 µmol/L) in nutrient solutions. The absorption band heights at 3350 cm-1 and 1642 cm-1 of stem tissues first increased and then decreased, which indicated that the...
Higher packaging density is driven by the multifunctional requirements and size shrinkage in handheld applications, which was greatly improved by the 3D packaging technologies. Package-on-package (POP) is one of the 3D packaging solutions, in which components can be fully tested good prior to integration. However, the package warpage due to mismatch of materials properties is a greater challenge for...
Wafer level Chip Scale Package (WLCSP) fulfills the demand for small, lightweight, and portable handheld electronic devices, and it's one of the most advanced packaging concepts. When the WLCSP was assembled on board level, the solder joints are generally the critical issue for device's reliability. Thermal shock (TS) was an effective way to test reliability of WLCSP for reducing the cost and time...
The parabolic-trough solar concentrator is the key component in parabolic-trough solar thermal power plants. The parabolic-trough solar concentrator is designed in this paper. It was analyzed under operational condition and under snow load. The model of the coefficient of accumulated snow with the different rotational angle is established. The coefficient was calculated with the model for a parabolic-trough...
Vacuum solar receiver is the key component in parabolic trough solar system. Due to different expansion increment between metal absorber and glass, corrugated expansion joint (metal bellows) is necessary to compensate the extra expansion increment. The mechanical and thermal properties of metal bellows have significant influence on the reliability and heat loss of solar receiver. Recently, China's...
Simply supported beams subjected to uniform was considered mechanical model of backfill roof of underhand drift cut-and-filling stopping, because high-span ratio of stratified backfill was relatively large, there might be some errors in the bearing capacity calculation of material mechanics, through the analysis of the model boundary shape and mechanical distribution characteristic, a semi-inverse...
Wafer level Chip Scale Package (WLCSP) fulfills the demand for small, light, and portable handheld electronic devices, and it is one of the most advanced packaging concepts. When the WLCSP was assembled on board level, the connection, i.e. solder joints are generally the critical and challenging issue for the whole device's reliability. In addition to the shape and material of solder joints, the material...
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