The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
As the density of board design increasing fast, the distance between the adjacent components becomes much smaller. When the miniature chip components and the fine pitch components which require smaller volumes of solder paste are close to the castle-like components, connectors with poor pin co-planarity and CCGAs which require more solder paste, only one single thickness stencil could not satisfy...
The benefits of using the low Ag solder in CSP package has been known in terms of the performance due to its intrinsic characteristic. In this study, SAC alloy dopanted D1 and D2 are selected to compare with the general solder alloy, SAC105, in terms of thermal fatigue fracture performance. The 0.5mm-pitch TFBGA packages on Halogen-free FR4 PCB treated with 150 C thermal aging at different period...
In this decade, the Moore's law does not fit the trend of technological improvement any more. In order to keep the increasing rate of device density and I/O numbers, the size of devices shrink rapidly. In this kind of condition, the stack of integrated circuit (IC), which is also called three-dimensional integrated circuits (3-D ICs), is a preferable solution of the next-generation products. There...
In recent years, electronic product have been demanded more functionalities, miniaturization, higher performance, reliability and low cost. Therefore, IC chip is required to deliver more signal I/O and better electrical characteristics under the same package footprint. None-Lead Bump Array (NBA) Chip Scale Structure is then developed to meet those requirements offering better electrical performance,...
The benefits shown in the reliability performance when using the low Ag solder in BGA package has been known due to its intrinsic characteristic. In this study, SAC alloy with the dopant D1 and D2 respectively are selected to compare with the widely-used solder alloy, SAC105, from the perspective of the thermal fatigue fracture. The 0.5mm-pitch TFBGA packages on Halogen-free FR4 PCB pre-treated at...
In this paper, we are interested in the Halogen-free (HF) impact on the reliability performance of portable electronic devices. Due to the trend of environment protection, the Halogen-free materials of solder paste, molding compounds, PCB and etc. have been widely discussed. When the material changes happen, the transition of failure modes in the board level can be expected, and the challenges are...
A strain-controllable dynamic bending method on WLCSP has been proposed in this paper. In order to identify the principle factor among the effects of stiffness attributed by different board level structures, the 0.4 mm pitch WLCSP packages with Sn-4.0Ag-0.5Cu solder ball are used. This combination of WLCSP is considered to have the high stiffness in the structure. It is also shown that there are interactions...
In this paper, a new application of 4-point cyclic bending test for the solder joint reliability evaluation is discussed. In light of the long cycle time of thermal cycle testing, the industry has been searching for a more cost-effective and time-effective way to achieve the evaluation task. The 4-point cyclic bending test is considered a good candidate in this study. The thermal cycle test and 4-point...
Effect of passivation opening on electromigration in eutectic SnPb solder joints is investigated in this study. Solder bumps were fabricated with a polyimide (PI) and without a PI layer. Both sets of solder joints were subjected to electromigration tests by 0.8A at 150??C. Kelvin probes were employed to monitor the increase in bump resistance during electromigration. The bump failure is defined when...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.