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Fatigue life evaluation of power devices is closely related to the temperature distribution on the solder layer. During thermal cycling, the solder layer reaches a uniform temperature. In case the power cycle becomes short, this state is different from the real active state of the power device. Because the real temperature distribution on the solder layer is non-uniform. Therefore, there is a difference...
For power module, the reliability evaluation of thermal fatigue life by power cycling has been prioritized as an important concern. Since in power cycling produces there exists non-uniform temperature distribution in the power module, coupled thermal-structure analysis is required to evaluate thermal fatigue mechanism. The thermal expansion difference between a Si chip and a substrate causes thermal...
This paper presents a fundamental method to evaluate power cycle fatigue life of power device. Coupled electrical-thermal analysis is performed to obtain the distribution of temperature due to electric current. Then, thermal-mechanical analysis is carried out to calculate inelastic strain range generated in a solder joint. In addition, the fatigue evaluation for aluminum wire bonding was carried out...
This paper presents a fundamental method to evaluate thermal fatigue life of power module. Coupled electrical-thermal analysis is performed to obtain the distribution of temperature due to electric current. Then, thermo-mechanical analysis is carried out to calculate inelastic, aluminum wire bonding was done. Crack path simulation technique was used to evaluate total fatigue life of solder joint and...
This paper presents a method mining the worst thermal fatigue life of solder joints on chip components used in vehicle electronics. Thermal fatigue life of crack initiation and propagation were calculated by using the finite element method. Statistical analysis of thermal fatigue life in the solder layer below the chip component was carried out. A sample of dispersed fatigue lives was generated by...
Semiconductors are solids whose electrical conductivity is intermediate between that of a conductor and an insulator. Semiconductor devices are active devices that consume, accumulate, and discharge the supplied electric power. They are used as electronic or power devices. The former are employed in the control systems of electrical products such as mobile phones and computers, which are controlled...
This paper presents a fundamental method to evaluate thermal fatigue life of power module. Coupled electrical-thermal analysis was performed to obtain the distribution of temperature due to electric current. Then, thermo-mechanical analysis was carried out to calculate inelastic strain range generated in a solder joint. Crack path simulation technique was used to evaluate total fatigue life and rise...
This paper presents mining the worst case of thermal fatigue life of solder joints on chip components used in vehicle electronics. Typical 36 cases with various solder shapes were examined. Thermal fatigue life including not only the crack initiation but also crack propagation was evaluated by using the finite element method. Based upon the case study's results, it was found that when a crack propagates...
For power devices, the reliability of thermal fatigue induced by power cycling has been prioritized as an important concern. Because, the power device like the converter system is the key in vehicle applications. So, high reliability is demanded by reduction in the size and high power capacity. Therefore shortening reliability evaluation is demanded using finite element method (FEM). Since power cycling...
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