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Since recent years, the micro-electronic industry changes the material usage, design and structure, in order to satisfy the customer demands of the higher performance and smaller size. One of the examples is the change of the basic materials from Al/SiO2 to Cu/low-k in IC interconnect structure. As a consequence, new reliability issues at device/product level have been discovered, and most of the...
With the increased use of mobile phones, navigation systems, PDA's, laptop's and portable gaming devices the drop reliability of microelectronics has become an important parameter. Assessing the solder interconnect quality by means of drop impact testing, as standardized by e.g. JEDEC, during normal production requires considerable amounts of time and effort. Besides this, the repeatability of the...
A common failure during the lifetime of most mobile devices is failure through dropping. This is nowadays tested by means of the drop impact test, which has been standardized by JEDEC. This method however takes quite some time and has some problems regarding reproducibility. This paper reports the work done on correlating the drop impact test with the cold bump pull that might be a replacement. The...
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