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Solder bump interconnection is a widely accepted approach for high performance and miniaturized packaging. Solder bump pitch of 90 mum or less will be needed to support chip-to-next-level packaging when the integrated circuitry features reach 45 nm by 2010 [ITRS 2004 Update - Assembly & Packaging]. Lead-free solder is expected to be widely implemented by then. Intermetallic compound (IMC) formation...
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