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Over the past 30 years, IBM has provided leadership in high density I/O density and count interconnects at both chip and package levels as has been necessary for processor chips in high end symmetrical multiple processor (SMP) servers. For example, IBM introduced multi-chip modules (MCMs) in the 1970's, thermal conduction modules (TCMs) in the 1980's, and advanced organic micro-via buildup-layer packages...
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