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Interlayer cooling removes the heat dissipated by vertically stacked chips in multiple integrated fluid cavities. Its performance scales with the number of dies in the stack and is therefore superior to traditional back-side heat removal. Previous work indicated that pin-fin arrays are ideally suited as through-silicon-via-compatible heat transfer structures. In addition, four-port fluid-delivery...
This paper focuses on two-phase flow boiling of refrigerant R134a inside a copper multi-microchannel heat sink for microelectronic central processing unit cooling applications. The heat sink is composed of 100 parallel microchannels, 100 μm wide, 680 μm high, and 15 mm long, with 72-μm-thick fins separating the channels. The base heat flux was varied from 2.57 to 189 W/cm2 and the mass flux from 205...
As the demand for new thermal technologies and materials has been increasing over the years to provide thermal solutions to the next generation of power electronics, microprocessors and high-power optical systems also thermal characterisation methods have to keep up with the pace of this development with respect to resolution and accuracy. We have developed both bulk and interface technologies to...
The following study concentrates on two-phase flow boiling of refrigerant R134a inside two similar copper multi-microchannel heat sinks, one of which was designed for singlephase water cooling of microprocessors. The two-phase heat sink was composed of 100 parallel microchannels, 100 μm wide, 680 μm high, 15 mm long with 72 μm-thick fins, and 63 parallel microchannels. Base heat fluxes and channel-based...
Integrating microchannels at the thermal interfaces of heat sinks, spreaders, and microprocessor chips can reduce bond line thickness, assembly pressure, and overall thermal resistance. The channels help control the flow of particle-filled thermal interface materials (TIM) during the assembly squeeze but the relationship between channel geometry, material properties, and interfacial area is not fully...
We demonstrate submerged single-phase direct liquid-jet-impingement cold plates that use arrays of jets with diameters in the range of 31 to 126 mum and cell pitches from 100 to 500 mum for high power-density microprocessor cooling applications. Using parallel inlet and outlet manifolds, a distributed return concept for easy scaling to 40,000 cells on an area of 4 cm was implemented. Pressure drops...
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