Search results for: Wei Cheng
IEEE Communications Letters > 2017 > 21 > 11 > 2520 - 2523
IEEE Transactions on Circuits and Systems I: Regular Papers > 2017 > 64 > 7 > 1661 - 1672
IEEE Microwave and Wireless Components Letters > 2017 > 27 > 5 > 464 - 466
IEEE Transactions on Device and Materials Reliability > 2015 > 15 > 4 > 588 - 594
IEEE Transactions on Microwave Theory and Techniques > 2015 > 63 > 9 > 2756 - 2763
IEEE Transactions on Device and Materials Reliability > 2015 > 15 > 1 > 109 - 114
IEEE Transactions on Microwave Theory and Techniques > 2015 > 63 > 2-1 > 367 - 373
IEEE Transactions on Electron Devices > 2015 > 62 > 1 > 75 - 82
IEEE Microwave and Wireless Components Letters > 2014 > 24 > 1 > 11 - 13
IEEE Microwave and Wireless Components Letters > 2014 > 24 > 7 > 487 - 489
IEEE Microwave and Wireless Components Letters > 2014 > 24 > 9 > 646 - 648
IEEE Transactions on Device and Materials Reliability > 2014 > 14 > 4 > 1049 - 1055
IEEE Transactions on Circuits and Systems I: Regular Papers > 2012 > 59 > 10 > 2340 - 2353
IEEE Transactions on Microwave Theory and Techniques > 2012 > 60 > 3-1 > 502 - 508
IEEE Transactions on Advanced Packaging > 2010 > 33 > 1 > 30 - 36
IEEE Transactions on Industrial Electronics > 2010 > 57 > 5 > 1573 - 1582
IEEE Transactions on Consumer Electronics > 2009 > 55 > 2 > 351 - 355
IEEE Microwave and Wireless Components Letters > 2007 > 17 > 11 > 784 - 786