The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
NANIUM's Fan-Out Wafer-Level Packaging technology WLFO (Wafer-Level Fan-Out) is based on embedded Wafer Level Ball Grid Array (eWLB) [1]. Since it's invention almost 10 years ago, it became the leading technology for Fan-Out Wafer-Level packages. The WLFO technology is based upon the reconstitution to wafer format of semiconductor dies or other active / passive components separated by mold compound...
Embedded Wafer Level Ball Grid Array (eWLB) [1] since it's invention has been the leading technology for Fan-Out Wafer-Level package. The development of eWLB technology involving the patterning of a Redistribution Layer over a reconstituted wafer has been hampered by remaining metal from the test structures applied by the foundries in the dicing streets of the incoming Si wafers for process control...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.