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In order to evaluate the techno-economic performance of Hybrid Energy System for remote rural area electrification, a mixed integer linear mathematical programming model (time-series) has been developed to determine the optimal operation, optimal configuration including the assessment of the economic penetration levels of photovoltaic array area, and cost optimization for a hybrid energy generation...
In current systems-on-chip (SoC) designs, managing peak temperature is critical to ensure operation without failure. Our novel communication architecture based thermal management (CBTM) scheme manages thermal behavior of components by delaying the execution of chosen IP-blocks or components by regulating the flow of data over the on-chip communication bus. This temperature aware traffic flow over...
On-Chip spiral inductors are the essential component of radio frequency integrated circuits (RFIC). The major bottleneck of RFIC design automation is the efficient parameterized synthesis of spiral inductors. RFIC designers always require inductors of maximum quality factor (Q) for a given inductance value. To find geometry parameters of spiral inductors of maximum quality factor subject to some constraints,...
Computer simulation is an increasingly popular tool for determining the most suitable hybrid energy system type, design and control for an isolated community or a cluster of villages. This paper presents the development of the optimum control algorithm based on combined dispatch strategies, to achieve the optimal cost of battery incorporated hybrid energy system for electricity generation, during...
Increased operating temperatures of chips have aggravated leakage and reliability issues, both of which are adversely affected by high temperature. Due to thermal diffusion among IP-blocks and the interdependence of temperature and leakage power, we observe that the floorplan has an impact on both the temperatures and the leakage of the IP-blocks in a system on chip (SoC). An increase in temperature...
Summary form only given. Improvements in the speed and the size of chips due to process scaling come with the penalties of increased power densities and higher operating temperatures. Higher temperature not only poses a risk of thermal runaway of the chips but also increases leakage-power dissipation and reduces interconnect lifetime. Furthermore, the floorplan of a System-on-a-Chip (SoC) has a significant...
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