The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The European X-Ray Free Electron Laser (XFEL) will provide ultra short, highly coherent X-ray pulses which will revolutionize scientific experiments in a variety of disciplines spanning physics, chemistry, materials science, and biology.
This paper presents a novel MEMS configuration for three dimensional on-chip fine positioning and mechanical fixing of a ball lens. A MEMS lens holder, which consists of a suspended mass, is attached onto a MEMS active alignment platform to achieve precision alignment and fixing of a ball lens with a diameter of 300µm in silicon photonics packaging. The operational principles of the system as well...
By leveraging on the wealth of Si-CMOS technology know-how and the largely available infrastructures, the fundamental photonic device building blocks and circuit integration platform, essential for the realization of the electronic-photonic integrated circuit (EPIC), have been successfully developed. This presentation gives an overview on the current status of this critical technology and provides...
This paper reports a novel silicon platform with integrated MEMS actuators, which is used for fine-positioning and locking of a ball-lens, to address the optical coupling issues in silicon photonics packaging. The fine-positioning and locking function of the ball-lens have been successfully demonstrated by the developed prototype silicon platform. The main adjusting actuator delivered a large force...
Research into the limits of electrical interconnects indicates that metal wire is unlikely to be the ultimate solution to support the growing functionalities of next generation microprocessor. Severe information latency and power consumption are key technological challenges facing the traditional copper interconnects which impose tremendous constraints to keep up with the performance roadmap known...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.